BdMatFAM: Base Material Specifications for Printed Boards

Member: $369.00

Nonmember: $737.00

This is a family of specifications for board materials used in the fabrication process.

IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials

IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry

IPC-4203 Cover and Bonding Material for Flexible Printed Circuitry

IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-4562 Metal Foil for Printed Board Applications

IPC-4563 Resin Coated Copper Foil for Printed Boards Guideline

Product ID: BASEMAT-STD-0-X-FK-EN-0