DVD-196C: Area Array Rework
Explains the advantages and challenges of area grid arrays, including component descriptions and terminology. Provides a visual overview of removal / replacement procedures for BGAs and QFNs, using both convection and IR equipment. Covers site preparation, reballing, component alignment, solder paste printing, preheating considerations and thermal profiles.
Explores potential problems, including moisture sensitivity, heating of adjacent components / solder joints, and soldering defects including misalignment, missing balls, voids, opens / shorts and partial or no reflow. Details X-ray analysis for solder joint inspection / evaluation as well as Direct transmission and CT inspection.
You can get 50% off when you upgrade from your existing DVD-96C training program. Contact Media Training Support for upgrade pricing.
Also available on Blu-ray, hi-definition video disc. With optional SDH(English) Subtitles for the Deaf or Hard of Hearing, and ESL students. Time: 23 minutes.
Also available in IPC EDGE for automated online training and testing.