DVD-196C: Area Array Rework
Explains the advantages and challenges of area grid arrays, including component descriptions and terminology. Provides a visual overview of removal / replacement procedures for BGAs and QFNs, using both convection and IR equipment. Covers site preparation, reballing, component alignment, solder paste printing, preheating considerations and thermal profiles.
Explores potential problems, including moisture sensitivity, heating of adjacent components / solder joints, and soldering defects including misalignment, missing balls, voids, opens / shorts and partial or no reflow. Details X-ray analysis for solder joint inspection / evaluation as well as Direct transmission and CT inspection.
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Includes Leader's Guide, Transcript, Review Questions, Training Certification Exam* (with certificates of completion) and Answer Key. Also available on Blu-ray, hi-definition video disc. (See "Related Products," below.) For unlimited usage at one facility. With optional SDH(English) Subtitles for the Deaf or Hard of Hearing, and ESL students. Time: 23 minutes.
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*Includes Training Certification.