SINGLE DEVICE DOWNLOAD
Release Date
SKU: 7095-STD-0-D-0-EN-C
Note:
This is a non-printable product.
Nonmember price: $183.00
Member price: $110.00
Your price: $183.00
MULTI-DEVICE DOWNLOAD
Release Date
SKU: 7095-STD-0-MDL-0-EN-C
Note:
This is a non-printable product.
Nonmember price: $183.00
Member price: $110.00
Your price: $183.00
Seats

Product Details

Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly.

In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes.

Published Date
ISBN
978-1-61193-080-1
Pages
165
DoD Adopted
No
ANSI Approved
No