IPC-HM-860: Specification for Multilayer Hybrid Circuits

Member: $84.00

Nonmember: $168.00

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.

Product ID: HM860-STD-0-D-0-EN-0