IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
Single-Device DRM-Protected Document
This document has single-device digital rights management (DRM) protection. Users of this document will only be able to open it on a single device. If you are purchasing this DRM-protected document for another user, you will need to provide contact information for that user when placing your order.
For information about IPC standards with DRM protection, visit www.ipc.org/drm.
Release Date: 4/4/2018
Product ID: J033-STD-0-D-0-EN-D