SINGLE DEVICE DOWNLOAD
Release Date
SKU: J033-STD-0-D-0-EN-D
Note:
This is a non-printable product.
Nonmember price: $103.00
Member price: $62.00
Your price: $103.00
MULTI-DEVICE DOWNLOAD
Release Date
SKU: J033-STD-0-MDL-0-EN-D
Note:
This is a non-printable product.
Nonmember price: $103.00
Member price: $62.00
Your price: $103.00
Seats
HARD COPY
Release Date
SKU: J033-STD-0-P-0-EN-D
Out of Stock
Will ship when available
Nonmember price: $121.00
Member price: $73.00
Your price: $121.00

Product Details

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.

Published Date
ISBN
978-1-61193-348-2
Pages
32
DoD Adopted
No
ANSI Approved
No