IPC-WP-023: IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: Via Chain Continuity Reflow Test: The Hidden Reliability Threat
IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures
IPC-WP-023 white paper provides an investigation of these issues using data collected from multiple printed board manufacturers and research conducted by the author.
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Product ID: 23-WP-0-D-0-EN-0