IPC-WP-023: IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: Via Chain Continuity Reflow Test: The Hidden Reliability Threate
IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures
IPC-WP-023 white paper provides an investigation of these issues using data collected from multiple printed board manufacturers and research conducted by the author.
Single-Device DRM-Protected Document
This document has single-device digital rights management (DRM) protection. Users of this document will only be able to open it on a single device. If you are purchasing this DRM-protected document for another user, you will need to provide contact information for that user when placing your order.
For information about IPC standards with DRM protection, visit www.ipc.org/drm.