IPC Global Solder Market Report (全球焊料市场报告) Subscription (Global License)
This report covers trends in electronics-grade solder and flux consumption worldwide and by region, based on findings from IPC’s Global Solder Statistical Program. Historical growth trends and current growth rates are segmented by product type, including solder paste, cored wire solder, solder alloy (bar and solid wire) and flux, and growth rates are based on unit consumption. The ratio of tin/ lead to lead-free solder, including historical trends, is presented by region and by product type. The regions covered are China, Japan, the rest of Asia, Europe and the Americas, and current regional percentage shares are shown for each product type. The current percentage of SAC alloys in lead-free solder are reported, as well as the industry’s three-month and 12-month growth outlook, historical metal price trends, and historical and forecast trends in metals and oil prices. The quarterly report is typically 36 pages.