Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision D incorporates resistance requirements to lead free soldering processes. 16 pages. Released April 2007.

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Included in the IPC-C-105 and the IPC-C-1000 Collections