"Underfill Selection and the Impact on Reliability" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011 by Dr. Brian Toleno, director of technical services and applications for Henkel. The author defines underfill and describes the types. He explaines the need for underfill and where it is typically used. He also explains the effects of different types of underfill in augmenting product reliability whether environmental or mechanical and their effect on reworkability. This presentation includes the synchronized slides and audio. 27 minutes. Released 2011.