IPC-7711-21B-Change1: Procedures are additions to the IPC-7711B/7721B
IPC-4554-AM1: Specification for Immersion Tin Plating for Printed Circuit Boards
IPC-4204A-AM1: Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B
IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-T-50K-DE: Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen
IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
On-Shoring in the Electronics Industry: Trends and Outlook for North America - 2013 Update (Global...
On-Shoring in the Electronics Industry: Trends and Outlook for North America - 2013 Update (Site...
On-Shoring in the Electronics Industry: Trends and Outlook for North America - 2013 Update (Single...
J-STD-003C: Solderability Tests for Printed Boards
IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
6013C: Qualification and Performance Specification for Flexible Printed Boards
IPC Executive Compensation Study for the North American Electronics Industry 2011-2012 (Single User)
IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-9641: High Temperature Printed Board Flatness Guideline
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-2291: Design Guideline for Printed Electronics
IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards