IPC-T-50K-DE: Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen
IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
On-Shoring in the Electronics Industry: Trends and Outlook for North America - 2013 Update (Global...
On-Shoring in the Electronics Industry: Trends and Outlook for North America - 2013 Update (Site...
On-Shoring in the Electronics Industry: Trends and Outlook for North America - 2013 Update (Single...
J-STD-003C: Solderability Tests for Printed Boards
IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
6013C: Qualification and Performance Specification for Flexible Printed Boards
IPC Executive Compensation Study for the North American Electronics Industry 2011-2012 (Single User)
IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-9641: High Temperature Printed Board Flatness Guideline
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-2291: Design Guideline for Printed Electronics
IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-5703: Cleanliness Guidelines for Printed Board Fabricators
CMDDGUIDE: Conflict Minerals Due Diligence Guide
Latin America: Regional Outlook for the Electronics Industry (Global License)