809 Products

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IPC-9252A-AM1: Requirements for Electrical testing of Unpopulated Printed Boards



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IPC-7711-21B-Change1: Procedures are additions to the IPC-7711B/7721B



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IPC-6013B-Errata: This is a list of reported errata to the printed copies of IPC-6013B



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IPC-4554-AM1: Specification for Immersion Tin Plating for Printed Circuit Boards



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IPC-4552-AM2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 2



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IPC-4552-AM1: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 1



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IPC-Study of Quality Benchmarks for Electronics Assembly 2018



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IPC-Study of Quality Benchmarks for Electronics Assembly 2018



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IPC-Study of Quality Benchmarks for Electronics Assembly 2018



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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)



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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)



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IPC-2221B Appendix A Version 2.0 June 2018



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IPC-4412B-AM1: Specification for Finished Fabric Woven from "E" Glass for Printed Boards



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IPC-4204A-AM1: Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry



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IPC-4203A-AM1: Cover and Bonding Material for Flexible Printed Circuitry



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IPC-4202A-AM2: Flexible Base Dielectrics for Use in Flexible Printed Circuitry



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IPC-4202A-AM1: Flexible Base Dielectrics for Use in Flexible Printed Circuitry



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IPC-4103-AM1: Specification for Base Materials for High Speed/High Frequency Applications



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IPC-2141A-Errata List



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IPC-1752A-Errata



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IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology



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APEX-EXPO18: IPC APEX 2018 Technical Conference Proceedings



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IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects



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IPC-2018 Annual Report on the North American PCB Industry - Global License