Publications

52 Products

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A-25: Multipurpose 1 & 2 Sided Test Pattern



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A-20/21: Standard Pitch Stencil Pattern for Slump



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A-43: Multi-Layer Flexible Circuits Test Pattern



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A-24: Surface Insulation Resistance



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A-22: UL Recognition Test Pattern



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A-25A: Multipurpose 1 Sided Test Pattern - DOWNLOAD KIT



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IPC-WP-008: Setting Up Ion Chromatography Capability



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SMC-WP-004: Design for Success



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SMC-WP-003: Chip Mounting Technology



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SMC-WP-001: WP-001 - Soldering Capability White Paper Report



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TR-585(D)1: Time, Temperature and Humidity Stress of Final Board Finish Solderability



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IPC-TR-583: An In-Depth Look At Ionic Cleanliness Testing



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IPC-TR-549: Measles in Printed Wiring Boards



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IPC-TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning...



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TR-464(D)1: Accelerated Aging for Solderability Evaluations



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TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology - Single User Download



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IPC-TR-465-3: Evaluation of Steam Aging on Alternative Finishes, Phase 11A



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IT-WP-001: Myths of E-Commerce - free download only



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IPC-TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs



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IPC-TR-467: Supporting Data and Numerical Examples for ANSI/J-STD-001B: APPENDIX D (Control of Fluxes)



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SPVC-TAL1: Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots



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Study of Quality Benchmarks for the Printed Circuit Board (PCB) Industry for 2005 - Summary...



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MILCERT-0915: Trends in Military Certifications: What You Need to Know About the Obvious and the...



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SPVC-LAT1: Analytical Procedures for Portable Lead-Free Alloy Test Data