TR-585: Time, Temperature and Humidity Stress of Final Board Finish Solderability
Publications: Technical Reports
IPC-TR-583: An In-Depth Look At Ionic Cleanliness Testing
IPC-TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning...
TR-464: Accelerated Aging for Solderability Evaluations
TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology - Single User Download
IPC-TR-465-3: Evaluation of Steam Aging on Alternative Finishes, Phase 11A
IPC-TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
IPC-TR-467: Supporting Data and Numerical Examples for ANSI/J-STD-001B: APPENDIX D (Control of Fluxes)
IPC-WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in...