84 Results for ipc-drm-

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...



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IPC-DRM-WHA-C Wire Harness Assembly Training & Reference Guide



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IPC-DRM-WHA-B: Wire Harness Assembly Training & Reference Guide



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IPC-DRM-18J: Component Identification Training and Reference Guide - English



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IPC-DRM-53: Introduction to Electronics Assembly Training & Reference Guide



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IPC-DRM-PTH-G: Through-Hole Solder Joint Evaluation Training & Reference Guide - English



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IPC-DRM-SMT-G: Surface Mount Solder Joint Evaluation Training & Reference Guide -English



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IPC-DRM-SMT-F-DE: Surface Mount Solder Joint Evaluation Training & Reference Guide



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IPC-DRM-PTH-F-DE: Through Hole Solder Joint Evaluation Training & Reference Guide



Member: $80.00

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)



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Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards



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IPC-2292: Design Standard for Printed Electronics on Flexible Substrates



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IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements



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IPC-1754: Material Declaration Standard for Aerospace and Defense



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IPC-7094A: Design and Assembly Process Implementation for Flip Chip and Die-Size Components - English



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IPC-9121-AM1: Troubleshooting for PCB Fabrication Processes, Amendment 1



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IPC-1753-WAM 1: Laboratory Report Standard - English



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IPC-4203B: Cover and Bonding Material for Flexible Printed Circuitry



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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications



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IPC-4412B-AM2: Specification for finished Fabric Woven from "E" Glass for Printed Boards



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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices



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IPC/PERM-2901: Pb-free Design and Assembly Implementation Guide - English



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IPC-A-610G: Acceptability of Electronic Assemblies



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IPC-2152: Standard for Determining Current Carrying Capacity in Printed Board Design