IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
210 Products
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IPC-7711/21C-电子组件的返工、修改和维修
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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求
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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
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IPC-A-600H-PL: Kryteria Dopuszczenia Płyt Drukowanych
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IPC-7530-HU: Útmutató tömegforrasztási (reflow és hullám) folyamatok hőmérsékleti profiljának kialakításához
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IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
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IPC-CH-65B-CN: 印制板及组件清洗指南
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IPC/WHMA-A-620B-CN: 线缆及线束组件的要求与验收
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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
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IPC-2291: Design Guideline for Printed Electronics
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CMPROCEEDINGS-2013: 2013 Conflict Minerals Conference Proceedings
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IPC-7711/21B-RU: Восстановление, модификация и ремонт электронных сборок
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IPC-6012C-RU: Требования к жестким печатным платам
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IPC-7093-DE: Einführung des Design- und Verarbeitungsprozess von Bottom Termination Components
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IPC/WHMA-A-620B-HU: IPC/WHMA-A-620B 1. módosításokat tartalmazó változat
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IPC-2221B-DE: Basisrichtlinie für das Design von Leiterplatten
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IPC-A-610E-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử
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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
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IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications
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J-STD-030A: Selection and Application of Board Level Underfill Materials
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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2