29 Products

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IPC-A-610DC-Telecom Addendum

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

Member: $246.00

Nonmember: $490.00

IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

Member: $123.00

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A-600GPL(D)1: Acceptability of Printed Boards

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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

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IPC-CH-65B-CN: 印制板及组件清洗指南

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

Member: $47.00

Nonmember: $93.00

IPC-7525B-CN: 模板设计指导

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Nonmember: $168.00

J-STD-004B-CN: 修订本 1 助焊剂要求

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Nonmember: $131.00

IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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Nonmember: $131.00

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

Member: $67.00

Nonmember: $135.00

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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IPC-7525B-DE: Designrichtlinie für Druckschablonen

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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Nonmember: $168.00

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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Nonmember: $93.00

IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices