57 Products

Member: $47.00

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IPC/JEDEC-J-STD-033D: Manejo, embalaje, transporte y uso de componentes sensibles a la humedad/reflujo y/o al proceso

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IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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IPC-6903A: 印刷电子设计与生产的术语及定义

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-J-STD-001GS: はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格」

Member: $99.00

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IPC-J-STD-001GS: はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格

Member: $53.00

Nonmember: $80.00

IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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Nonmember: $137.00

IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

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IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-4412B-AM2: Specification for finished Fabric Woven from "E" Glass for Printed Boards

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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

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IPC-9121-AM1: Troubleshooting for PCB Fabrication Processes, Amendment 1

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IPC-1753-WAM1: Laboratory Report Standard

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IPC-1753-WAM 1: Laboratory Report Standard - English