117 Products

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IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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IPC-9121: 印制板制造工艺问题解答

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IPC-9121: 印制板制造工艺问题解答

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IPC-6903A: 印刷电子设计与生产的术语及定义

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IPC-A-600J: Baskı Devre Kartlarının Kabul Edilebilirliği

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-J-STD-001GS: はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格」

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IPC-J-STD-001GS: はんだ付される電気及び電子組立品に関する要件事項-「宇宙·軍事用途向け追加規格

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IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

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IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

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IPC-1601A: Guía para el manejo y almacenamiento de tarjetas impresas

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IPC-1601A: Guía para el manejo y almacenamiento de tarjetas impresas

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-4412B-AM2: Specification for finished Fabric Woven from "E" Glass for Printed Boards

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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620

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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620