444 Products

Member: $47.00

Nonmember: $93.00

IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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Nonmember: $160.00

IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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IPC-4591A: 印刷电子功能导电材料要求

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Nonmember: $341.00

IPC-9121: 印制板制造工艺问题解答

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Nonmember: $341.00

IPC-9121: 印制板制造工艺问题解答

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Nonmember: $95.00

IPC-6903A: 印刷电子设计与生产的术语及定义

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Nonmember: $95.00

IPC-6903A: 印刷电子设计与生产的术语及定义

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Nonmember: $93.00

IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

Member: $47.00

Nonmember: $93.00

IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

Member: $68.00

Nonmember: $137.00

IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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Nonmember: $137.00

IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

Member: $47.00

Nonmember: $95.00

IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

Member: $79.00

Nonmember: $155.00

IPC-4556: 印制板化学镍/钯/浸(ENEPIG)规范

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Nonmember: $155.00

IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

Member: $83.00

Nonmember: $166.00

IPC-4101E: 刚性及多层印制板用基材规范

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IPC-4101E: 刚性及多层印制板用基材规范

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IPC-6013D: 挠性和刚挠印制板的鉴定及性能规范

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IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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Nonmember: $137.00

IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

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IPC-1791: Trusted Electronic Designer, Manufacturer and Assembler Requirements

Member: $84.00

Nonmember: $168.00

IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)