IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble

IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

A-610DJP(D)1: Acceptability of Electronic Assemblies

J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

J-STD-004A-JP: Requirements for Soldering Fluxes

IPC-7711/21B-HU: Elektronikai szerelvények újramunkálása, módosítása és javítása

IPC-7711/21B-CZ: Přepracování, modifikace a opravy elektronických sestav

IPC-A-610D-CZ: Acceptability of Electronic Assemblies

J-STD-075-CN: 组装工艺中非IC电子元器件的分级

4562A-CN: 印制板用金属箔

IPC-7711/21B-CN: 电子组件的返工、修改和维修

J-004A-CN: SUPERSEDED BY J-STD-004B-CN

J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

7095B(D)1: Design and Assembly Process Implementation for BGAs