IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies
A-600GPL(D)1: Acceptability of Printed Boards
IPC/WHMA-A-620A-PL: Rev A superseded by Rev B
J-STD-004B-CN: 修订本 1 助焊剂要求
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components