Acceptance

98 Products

Member: $95.00

Nonmember: $190.00

IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620



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Nonmember: $125.00

IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical...



Member: $45.00

Nonmember: $90.00

IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C



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Nonmember: $90.00

IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C



Member: $65.00

Nonmember: $130.00

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English



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Nonmember: $130.00

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...



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Nonmember: $250.00

IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English



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Nonmember: $300.00

IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline



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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility



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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English



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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards



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Nonmember: $190.00

IPC-A-610G: Acceptability of Electronic Assemblies



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Nonmember: $160.00

J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies



Member: $95.00

Nonmember: $190.00

IPC-A-610G: Acceptability of Electronic Assemblies



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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies



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Nonmember: $533.00

7090-FAM: Packages for PCBs and Assemblies



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BdMatFAM: Base Material Specifications for Printed Boards



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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies



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Nonmember: $508.00

PtdEleFAM: Printed Electronics Family



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Nonmember: $541.00

SolMatFAM: Solder Materials Family



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Nonmember: $160.00

IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1



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J-STD-001D: Rev D superseded by Rev E



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TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology - Single User Download



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IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations