257 Products

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies



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IPC-A-610E-RL: Acceptability of Electronic Assemblies



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IPC-A-610DC-Telecom Addendum



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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum



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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...



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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes



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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1



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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014



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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline



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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...



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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620



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IPC-1753-WAM 1: Laboratory Report Standard - English



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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard



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IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical...



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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard



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IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C



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IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C



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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices



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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices



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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English



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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...



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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English



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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline



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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility