IPC-4550-FAM: Plating Specifications

7090-FAM: Packages for PCBs and Assemblies

BdMatFAM: Base Material Specifications for Printed Boards

CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

PtdEleFAM: Printed Electronics Family

SolMatFAM: Solder Materials Family

IPC-2220-FAM: Design Standards for Printed Boards

IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1

J-STD-001D: Rev D superseded by Rev E

J-006A: SUPERSEDED BY J-STD-006B

D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

SMEMA 7: SMEMA7 - Fluid Dispensing Terms and Definitions

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

SMEMA 5: SMEMA5 - Screen Printing Terms and Definitions

SMEMA 4: SMEMA4 - Reflow Terms and Definitions

IPC-S-816: SMT Process Guideline Checklist

IPC-OI-645: Standard for Visual Optical Inspection Aids

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-HM-860: Specification for Multilayer Hybrid Circuits

J-004A: SUPERSEDED BY J-STD-004B