7090-FAM: Packages for PCBs and Assemblies
Standards: Electronics Assembly: Components
BdMatFAM: Base Material Specifications for Printed Boards
CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies
SolMatFAM: Solder Materials Family
J-STD-075-CN: 组装工艺中非IC电子元器件的分级 (Chinese Language)
J-STD-004B-CN: 修订本 1 助焊剂要求 - Chinese Language
IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级 (Chinese)
IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试 (Chinese Language)
IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级 (Chinese Language)
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices - German Language
J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes - German Language
IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
IPC-CM-770E: Component Mounting Guidelines for Printed Boards
IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing
7095A(D)1: Design and Assembly Process Implementation for BGAs
1756: Manufacturing Process Data Management