Standards: Electronics Assembly: Components

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IPC-7711/21C: Az elektronikai szerelvények újramunkálása, módosítása és javítása

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IPC-7711/21C: 전자 어셈블리들의 리웤, 변경 및 수리

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IPC-J-STD-033D: 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-7711/21C-French: Reprise, Modification et Réparation des Assemblages Électroniques

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IPC-7711/21C: 電子組立品のリワーク、改造およびリペア

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IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble

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IPC/JEDEC J-STD-609A Errata Information

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-7711/21C:Reparación, Modificación y Reparación de Ensambles Electrónicos - Spanish

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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German

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IPC-A-610F-TR: Ek1'i içerir

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IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

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J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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9702-CN: 板极互连的单向弯曲特性描述

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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J-STD-004B-CN: 修订本 1 助焊剂要求

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IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...