IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施
Standards: Electronics Assembly: Components
4 Products
Member: $84.00 Nonmember: $168.00
Member: $84.00 Nonmember: $168.00
IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects
Member: $84.00 Nonmember: $168.00
IPC-9850A: Surface Mount Placement Equipment Characterization
Member: $84.00 Nonmember: $168.00
IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components