Standards: Electronics Assembly: Components

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Narrowed By: 2008

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IPC-J-STD-75: Clasificación de componentes electrónicos no-IC para procesos de ensamble



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IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble



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J-STD-075-CN: 组装工艺中非IC电子元器件的分级



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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...



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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices



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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...



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J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes



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7095B(D)1: Design and Assembly Process Implementation for BGAs