Standards: Electronics Assembly: Components

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Narrowed By: 2009

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J-STD-004B-CN: 修订本 1 助焊剂要求

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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IPC-4553A-CN: 印制板浸银规范