Standards: Electronics Assembly: Components

58 Products

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IPC/JEDEC J-STD-609A Errata Information



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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014



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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices



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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices



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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English



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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...



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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility



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7090-FAM: Packages for PCBs and Assemblies



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BdMatFAM: Base Material Specifications for Printed Boards



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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies



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SolMatFAM: Solder Materials Family



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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components



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IPC-CM-770E: Component Mounting Guidelines for Printed Boards



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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...



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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing



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7095A(D)1: Design and Assembly Process Implementation for BGAs



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1756: Manufacturing Process Data Management



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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2



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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives



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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards



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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly



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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects



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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies



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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...