Standards: Electronics Assembly: Components

93 Products

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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

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IPC-7711/21C-电子组件的返工、修改和维修

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7090-FAM: Packages for PCBs and Assemblies

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BdMatFAM: Base Material Specifications for Printed Boards

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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

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SolMatFAM: Solder Materials Family

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IPC-A-610F-TR: Ek1'i içerir

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IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

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J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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9702-CN: 板极互连的单向弯曲特性描述

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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J-STD-004B-CN: 修订本 1 助焊剂要求

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IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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7095A(D)1: Design and Assembly Process Implementation for BGAs