Standards: Electronics Assembly: Components

81 Products

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards



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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...



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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing



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7095A(D)1: Design and Assembly Process Implementation for BGAs



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1756: Manufacturing Process Data Management



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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2



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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives



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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards



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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly



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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects



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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies



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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...



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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies



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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products



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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001



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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1



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9702-WAM1: Monotonic Bend Characterization of Board-Level Interconnects



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J-STD-048: Notification Standard for Product Discontinuance



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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices



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IPC-7092: Design and Assembly Process Implementation for Embedded Components



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IPC-AJ-820A: Assembly & Joining Handbook



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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001



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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries



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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability