Standards: Electronics Assembly: Components

83 Products

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IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级



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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试



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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级



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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...



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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...



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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices



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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes



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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components



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IPC-CM-770E: Component Mounting Guidelines for Printed Boards



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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...



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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing



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7095A(D)1: Design and Assembly Process Implementation for BGAs



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1756: Manufacturing Process Data Management



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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2



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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives



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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards



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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly



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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects



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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies



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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...



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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies



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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products



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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001



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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1