Standards: Electronics Assembly: Components

93 Products

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1756: Manufacturing Process Data Management

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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9702-WAM1: Monotonic Bend Characterization of Board-Level Interconnects

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J-STD-048: Notification Standard for Product Discontinuance

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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7095B(D)1: Design and Assembly Process Implementation for BGAs