Standards: Electronics Assembly: Components

93 Products

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components

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IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

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IPC-A-610F-TR: Ek1'i içerir

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...

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IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly