Standards: Electronics Assembly: General

84 Products

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IPC-WP-019: An Overview on Global Change in Ionic Cleanliness Requirements



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IPC-WP-019: An Overview on Global Change in Ionic Cleanliness Requirements



Member: $210.00

Nonmember: $420.00

IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline



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7090-FAM: Packages for PCBs and Assemblies



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SolMatFAM: Solder Materials Family



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IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies



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J-STD-001D: Rev D superseded by Rev E



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SMEMA 7: SMEMA7 - Fluid Dispensing Terms and Definitions



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SMEMA 5: SMEMA5 - Screen Printing Terms and Definitions



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SMEMA 4: SMEMA4 - Reflow Terms and Definitions



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SMEMA 6: SMEMA6 - Electronics Cleaning Terms and Definitions



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SMEMA 3.1: SMEMA3.1 - Fiducial Mark Standard



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IPC-CM-770E: Component Mounting Guidelines for Printed Boards



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IPC-A-610D WAM1: Acceptability of Electronic Assemblies



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IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline



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9191: General Guidelines for Implementation of Statistical Process Control (SPC)



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7095A(D)1: Design and Assembly Process Implementation for BGAs



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1756: Manufacturing Process Data Management



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IPC-A-610E: Acceptability of Electronic Assemblies



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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies



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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology



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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires



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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives



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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards