Standards: Electronics Assembly: Material

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Narrowed By: 2009

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...



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J-STD-004B-CN: 修订本 1 助焊剂要求



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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...



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T-50H-CN: 电子电路互连与封装术语及定义