Standards: Electronics Assembly: Material

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Narrowed By: 2013

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IPC-4556: 印制板化学镍/钯/浸(ENEPIG)规范

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

Member: $79.00

Nonmember: $155.00

IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

Member: $79.00

Nonmember: $155.00

IPC-7095C: Design and Assembly Process Implementation for BGAs