Standards: Electronics Assembly: Material

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求



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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试



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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...



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IPC-7095C: Design and Assembly Process Implementation for BGAs



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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations



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J-STD-048: Notification Standard for Product Discontinuance



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IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1



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IPC-7092: Design and Assembly Process Implementation for Embedded Components



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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries



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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...



Member: $75.00

Nonmember: $148.00

IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries



Member: $57.00

Nonmember: $113.00

IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试



Member: $75.00

Nonmember: $148.00

IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations



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Nonmember: $118.00

J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F



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IPC-7092: Design and Assembly Process Implementation for Embedded Components



Member: $75.00

Nonmember: $148.00

IPC-7095C: Design and Assembly Process Implementation for BGAs