Standards: Electronics Assembly: Material

23 Products

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

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IPC-1753: Laboratory Report Standard

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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Nonmember: $155.00

IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

Member: $79.00

Nonmember: $155.00

IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products

Member: $41.00

Nonmember: $83.00

IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-4202B: Flexible Base Dielectrics for Use in Flexible Printed Boards

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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Nonmember: $155.00

IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-1753: Laboratory Report Standard