Standards: Electronics Assembly: Material

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T-50H-CN: 电子电路互连与封装术语及定义



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J-004A-CN: SUPERSEDED BY J-STD-004B-CN



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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1



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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...



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J-STD-001D-SP: Requirements for Soldered Electrical and Electronic Assemblies



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J-STD-001E-SP: Requisitos de Ensambles Eléctricos y Electrónicos Soldados



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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés



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J-STD-001D-IT: Requirements for Soldered Electrical and Electronic Assemblies



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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies



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J-STD-001D: Rev D superseded by Rev E



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J-006A: SUPERSEDED BY J-STD-006B



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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline



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J-004A: SUPERSEDED BY J-STD-004B



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J-004: SUPERSEDED BY J-STD-004A



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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...



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IPC-CA-821: General Requirements for Thermally Conductive Adhesives - Single User Download



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9500K: Assembly Process Component Simulations, Guidelines & Classifications Package



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IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films



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IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives



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1756: Manufacturing Process Data Management



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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1



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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies



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IPC-1753: Laboratory Report Standard



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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...