Standards: Electronics Assembly: Process Support

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IPC-J-STD-001G: はんだ付される電気及び電⼦組立品に関する要件事項



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IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical...



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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices



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IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求 - Chinese



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IPC-J-STD-001G: Nõuded joodetud elektri- ja elektroonikakoostudele



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IPC-7527: 焊膏印刷要求 - Chinese



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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English



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IPC-7711/21C: Reparación, Modificación y Reparación de Ensambles Electrónicos - Spanish



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IPC-7711/21C: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen - German



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IPC-7711/21C-电子组件的返工、修改和维修



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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies



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IPC-7530-HU: Útmutató tömegforrasztási (reflow és hullám) folyamatok hőmérsékleti profiljának kialakításához



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IPC-7093-DE: Einführung des Design- und Verarbeitungsprozess von Bottom Termination Components



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IPC-A-610E-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử



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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives



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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices



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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures



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A-610E-EE: Elektroonikakoostude vastavusnõuded



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IPC-A-610E-CZ: Kritéria přijatelnosti elektronických sestav



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IPC-7095C-CN: BGA设计与组装工艺的实施



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J-STD-001F-WAM1-CN: 焊接的电气和电子组件要求修订版F附修订本1



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IPC-SM-785-CN: 表面贴装焊接连接加速可靠性测试指南



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IPC-7530-CN: 群焊工艺温度曲线指南(再流焊和波峰焊)



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IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products