Standards: Electronics Assembly: Process Support

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Narrowed By: 2015

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J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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IPC-A-610F-SE: Acceptanskrav för kretskort

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

Member: $41.00

Nonmember: $83.00

IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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IPC-7092: Design and Assembly Process Implementation for Embedded Components