Standards: Electronics Assembly: Process Support

229 Products

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J-STD-001E-SP: Requisitos de Ensambles Eléctricos y Electrónicos Soldados



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A-610DSP: Acceptability of Electronic Assemblies



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IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos



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IPC/WHMA-A-620A-SP: Requerimientos y Aceptación para Ensamble de Arneses de Cable y Alambre



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IPC-A-610E-FR: Acceptabilité des assemblages électroniques



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IPC-A-610F-FR: Acceptabilité des assemblages électroniques



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IPC-A-610DFR: Acceptability of Electronic Assemblies



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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés



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A-620A-FR: Exigences et critères d’acceptation pour l’assemblage des câbles et faisceaux de câbles



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A-610DIT: Acceptability of Electronic Assemblies



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IPC-A-610E-IT: Accettabilità degli Assemblaggi Elettronici



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J-STD-001D-IT: Requirements for Soldered Electrical and Electronic Assemblies



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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie



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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies



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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices



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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B



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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen



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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes



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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile



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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen



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J-STD-001D: Rev D superseded by Rev E



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IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting



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IPC-S-816: SMT Process Guideline Checklist



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J-004A: SUPERSEDED BY J-STD-004B