IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects
Standards: Electronics Assembly: Quality/Test
10 Products
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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620
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IPC-HDBK-620: Handbook and Guide to IPC-D-620 & IPC/WHMA-A-620
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IPC-J-STD-001GS: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical...
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IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C
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IPC/WHMA-A-620C-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620C
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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
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IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
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IPC/WHMA-A-620C: ケーブル・ワイヤーハーネス組立の要求事項及び許容基準 - Japanese
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IPC/WHMA-A-620C: ケーブル・ワイヤーハーネス組立の要求事項及び許容基準 - Japanese