Standards: Electronics Assembly: Rework/Repair

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1



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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata



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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用



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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile



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J-STD-004B-CN: 修订本 1 助焊剂要求



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T-50H-CN: 电子电路互连与封装术语及定义



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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies



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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...



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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components