7095A(D)1: Design and Assembly Process Implementation for BGAs

IPC-A-610E: Acceptability of Electronic Assemblies

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

IPC-A-610F: Acceptability of Electronic Assemblies

IPC-7095C: Design and Assembly Process Implementation for BGAs

J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

7095B(D)1: Design and Assembly Process Implementation for BGAs

IPC-7711/21B: Rework, Modification and Repair of Electronic Assemblies

IPC-7525B: Stencil Design Guidelines

IPC-7711/21B-RU: Восстановление, модификация и ремонт электронных сборок

IPC-7711/21B-RO: Refacerea, Modificarea și Reparația Ansamblurilor Electronice

IPC-7711/21B-DE: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen

IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

IPC-A-610F-TH: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

IPC-A-610E-JP: 電子組立品の許容基準

DVD-SP41C: Through-Hole Rework -- Retrabajo de Tecnologia de Orificios, SPANISH / ENGLISH

IPC-7711/21B-FR: Reprise, Modification et Réparation des Assemblages Electroniques

IPC-A-610F-IT-WAM1: Accettabilità degli Assemblaggi Elettronici

IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...