IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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Standards: Electronics Assembly: Rework/Repair
105 Products
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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1
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7095B(D)1: Design and Assembly Process Implementation for BGAs
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IPC-7711/21B: Rework, Modification and Repair of Electronic Assemblies
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IPC-7525B: Stencil Design Guidelines
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IPC-7711/21B-RU: Восстановление, модификация и ремонт электронных сборок
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IPC-A-610E-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử
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A-610E-EE: Elektroonikakoostude vastavusnõuded
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IPC-A-610E-CZ: Kritéria přijatelnosti elektronických sestav
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IPC-7711/21B-RO: Refacerea, Modificarea și Reparația Ansamblurilor Electronice
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IPC-7711/21B-DE: Nacharbeit, Änderung und Reparatur von elektronischen Baugruppen
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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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IPC-A-610F-TH: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์
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IPC-A-610E-TR: Elektronik Takımların Kabul Edilebilirliği
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IPC-7711/21B-TR: Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım
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IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten
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IPC-7711/21B-KR: 전자 어셈블리의 리웍, 수정 및 수리
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IPC-A-610E-JP: 電子組立品の許容基準
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IPC-7711/21B-HU: Elektronikai szerelvények újramunkálása, módosítása és javítása
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IPC-7711/21B-DK: Rework, modifikation og reparation af elektronikprodukter
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DVD-SP41C: Through-Hole Rework -- Retrabajo de Tecnologia de Orificios, SPANISH / ENGLISH
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IPC-7711/21B-FR: Reprise, Modification et Réparation des Assemblages Electroniques
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IPC-A-610F-IT-WAM1: Accettabilità degli Assemblaggi Elettronici