Standards: Electronics Assembly: Solderability

19 Products

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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Nonmember: $155.00

IPC-4556: 印制板化学镍/钯/浸(ENEPIG)规范

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Nonmember: $137.00

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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Nonmember: $155.00

IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

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Nonmember: $109.00

IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

Member: $117.00

Nonmember: $234.00

J-STD-001E-RO: Cerinţe pentru Ansamblurile Electrice şi Electronice Lipite

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Nonmember: $234.00

J-STD-001E-HU: Villamos és elektronikai szerelvények forrasztási követelményei

Member: $60.00

Nonmember: $119.00

IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

Member: $79.00

Nonmember: $155.00

J-STD-003C-CN-WAM1: 印制板可焊性测试

Member: $117.00

Nonmember: $234.00

J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés

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IPC-AJ-820A: Assembly & Joining Handbook

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Nonmember: $168.00

IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...

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Nonmember: $155.00

IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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Nonmember: $124.00

IPC-4562A-WAM1: Metal Foil for Printed Board Applications

Member: $62.00

Nonmember: $124.00

J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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Nonmember: $155.00

J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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Nonmember: $155.00

IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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Nonmember: $155.00

IPC-7095C: Design and Assembly Process Implementation for BGAs