Standards: Electronics Assembly: Solderability

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Narrowed By: 2013

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IPC-4556: 印制板化学镍/钯/浸(ENEPIG)规范

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

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IPC-7095C: Design and Assembly Process Implementation for BGAs