Standards: Electronics Assembly: Solderability

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T-50H-CN: 电子电路互连与封装术语及定义



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J-004A-CN: SUPERSEDED BY J-STD-004B-CN



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J-STD-001D-SP: Requirements for Soldered Electrical and Electronic Assemblies



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J-STD-001E-SP: Requisitos de Ensambles Eléctricos y Electrónicos Soldados



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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés



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J-STD-001D-IT: Requirements for Soldered Electrical and Electronic Assemblies



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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies



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J-STD-001D: Rev D superseded by Rev E



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J-004A: SUPERSEDED BY J-STD-004B



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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies



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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2



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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies



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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly



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IPC-7095C: Design and Assembly Process Implementation for BGAs



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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies



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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...



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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001



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IPC-4562A-WAM1: Metal Foil for Printed Board Applications



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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1



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IPC-AJ-820A: Assembly & Joining Handbook



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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001



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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components



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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1



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7095B(D)1: Design and Assembly Process Implementation for BGAs