425 Products

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Nonmember: $250.00

IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English



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Nonmember: $300.00

IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline



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IPC-A-610G: Acceptability of Electronic Assemblies



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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies



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IPC-7091: Design and Assembly Process Implementation of 3D Components



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IPC-7091: Design and Assembly Process Implementation of 3D Components



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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards



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IPC-7525B-RU: Руководство по конструированию трафаретов



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IPC-7711/21C-电子组件的返工、修改和维修



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IPC-A-610G: Acceptability of Electronic Assemblies



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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies



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J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés



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IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques



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IPC-2513A: Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description



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IPC-1072AM1: Intellectual Property Protection in Electronic Assembly Manufacturing



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IPC-4550-FAM: Plating Specifications



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IPC-6010-FAM: Printed Board Performance Specifications



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7090-FAM: Packages for PCBs and Assemblies



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BdMatFAM: Base Material Specifications for Printed Boards



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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies



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PtdEleFAM: Printed Electronics Family



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SolMatFAM: Solder Materials Family



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IPC-2220-FAM: Design Standards for Printed Boards



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IPC-7095C-CN: BGA设计与组装工艺的实施