152 Products

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Nonmember: $330.00

IPC-7711/21C-电子组件的返工、修改和维修



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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求



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IPC-CH-65B-CN: 印制板及组件清洗指南



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IPC/WHMA-A-620B-CN: 线缆及线束组件的要求与验收



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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...



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IPC-2291: Design Guideline for Printed Electronics



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IPC-7711/21B-RU: Восстановление, модификация и ремонт электронных сборок



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IPC-7093-DE: Einführung des Design- und Verarbeitungsprozess von Bottom Termination Components



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IPC/WHMA-A-620B-HU: IPC/WHMA-A-620B 1. módosításokat tartalmazó változat



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IPC-2221B-DE: Basisrichtlinie für das Design von Leiterplatten



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IPC-A-610E-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử



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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology



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IPC-4552 WAM1&2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards



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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2



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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives



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IPC/WHMA-A-620B-EE: Juhtme- ja kaablikoostude vastavusnõuded



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IPC/WHMA-A-620B-TR: Kablo ve Kablo Takımları için Kabul Gereklilikleri



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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices



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IPC/WHMA-A-620B-PL: Wymagania i akceptacje dla montażu kabli i wiązek przewodów



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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures



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A-610E-EE: Elektroonikakoostude vastavusnõuded



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IPC-4556: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards



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IPC-A-610E-CZ: Kritéria přijatelnosti elektronických sestav



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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries